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cessive etching of the quartz minerals. The presence of mica was reported in OSL dating studies either as a contaminant mineral phase (Lomax et al., 2014) or as mineral inclusion in quartz or feldspar grains (Meyer et al., 2013). However, only a few studies have focused on .
Dose rates are listed for IRSL in Table 2 in the manuscript, and quartz OSL in Table B4. For the corresponding quartz OSL dose rates, the alpha component, as well as about 10% of the beta component, must be subtracted, due to the HF etch performed on the quartz grains before they were analyzed for OSL.
Use of magnetic separation for purifying quartz for luminescence dating Naomi Porat ... These chert grains could not be dated by OSL as, first, they were mostly not allochthonous but formed ... will remove any remaining feldspars while etching the quartz. A smaller volume of HF occasionally resulted in IR signals. It should be noted that even in
3.2 If you do not plan to do another BHF etch in the near future, dump the used BHF into the HF waste bottle. There is a polyethylene funnel you should use. The HF waste bottle must also be made of polyethylene. It should be labeled as containing HF and ammonium fluoride. Check of "corrosive" and "toxic" on the hazardous waste tag.
Abstract. The anisotropic etching behaviour of monocrystalline quartz is studied both experimentally and with computer simulations. The etch rate minima were identified as the crystal planes m, r, r2, sand s4. Various shapes and initial structures, both concave and convex, have been produced by etching quartz wafers in an HF:NH4F solution ...
silica/quartz), in contrast, results in optically transparent surfaces but the etch rate is on the order of 1 m/min [μ 3]. While methods have been developed to reduce the loss of optical clarity during borosilicate HF etching [21, 23], fused silica still has the advantage of
quartz grains was removed by etching. The conversion factors of Adamiec and Aitken (1998) and beta-particle attenuation factors after Mejdahl (1979) have been used. Sample water content was calculated following desiccation at 50 °C, and an uncertainty of 5% assumed. Table DR2 contains the dosimetry data for the OSL samples from the ...
A SIMPLE METHOD TO SEPARATE QUARTZ AND FELDSPAR AND ITS APPLICATION TO TL/OSL... 42 H2FSi6) or/and the density separation. The latter is used when the purpose is to analyse the feldspar fraction, and is a rather skilled and time consuming procedure. The acid etching aims at preferentially dissolving feldspars,
μm which favor in OSL quartz dating studies; the later fraction was found in abundance thus all measurements were performed using the 125‐250 μm and in only one sample (5‐3‐M5) use of both fractions was practiced. The next step involved etching in 40% HF to remove the
Use of magnetic separation for purifying quartz for luminescence dating. ... remaining after HF etching is so low that it cannot be . ... Geomorphic analysis and optically stimulated luminescence ...
both HF experimental conditions (etching time, HF concentration, agitation) and the nature/o-rigin of the minerals have a significant effect on etching rate and magnitude. For the sam-ples considered in this study, the outer 10 m of quartz (i.e., the usual etching target in .
Characterization of deep wet etching of fused silica glass for single cell and optical sensor deposition Haixin Zhu1, Mark Holl, Tathagata Ray, Shivani Bhushan and Deirdre R Meldrum Center for Ecogenomics, The Biodesign Institute, Arizona State University, Tempe, AZ 85287, USA E-mail: [email protected]
Purified quartz (180–250μm) was extracted from this sample, first by treatment with HCl and H 2O 2, followed by sieving, heavy liquid separation (using densities of 2.62 and 2.75g/cm3) and finally 40% HF etching for 40min. The purity of the quartz extract was checked using the conventional IR depletion test (Duller, 2003). It was was further
Apr 25, 2000· A reaction mechanism is proposed for the dissolution process of silicon dioxide networks in aqueous HF-based solutions. Etch experiments with thermally grown silicon dioxide were used to create a model for the etch process. Literature data on the etching of other vitreous silicon dioxide materials were used to refine the model. A new method, using a quartz microbalance, is used to .
QUARTZ SEPARATION BY SELECTIVE ETCHING WITH HF Summary For preparing very pure quartz separates. Most silicate minerals dissolve faster than quartz in dilute HF and can be etched away to leave a very pure quartz residue. Some quartz is lost - usually ~10% of coarse-grained fractions (500-850 ∝m) and up to 20-30% of fine-grained fractions (250 ...
etchant. It may find use as a hard mask for plasma etching due to its low etch rate, and as a dry lubricant in MEMS. B. Silicon Dioxide Fused Quartz Wafer: Wafers of General Electric 124 or NSG N fused quartz source material, % silicon dioxide, with amorphous structure (as opposed to true crystalline quartz). This material is commonly referred ...
For quartz, grain size range of 125-150 μm were separated and etched with 40% hydrofluoric acid (HF) solution for at least 40 minutes prior to mounting on aluminum discs. The purpose of the HF etching was to remove any possible feldspar grains and to etch away the alpha irradiated outer layer (about 10μm) of the quartz grains. The
feldspars and etch the quartz. Because of the size reduction during HF etching, HF-etched quartz grains were re-sieved to remove grains that were smaller than 63-250 μm. Feldspar con-tamination was detected using infrared stimu-lated luminescence (IRSL), which was measured on a few aliquots of each paleosol quartz sample (Spooner et al., 1990).
Etching of SiO 2, Quartz, and Glasses with HF Hydrofluoric acid is the only etchant which attacks amorphous SiO 2, quartz, or glasses at significant high etch rate. However, HF is not only a strong corrosive, but also highly toxic towards higher concentra-tions: Local effects include tissue destruction and necrosis, deaths have been reported from
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching.
Jan 01, 2019· Dr Mathieu Duval. Menu. Research. Bio. Contact. Publications. Outreach. Projects. Conferences. Editorial. ... Uncertainty on grain size and shape and its impact on ESR/OSL dating of quartz and feldspar grains; Quantifying HF etching on quartz and feldspars. KEYWORDS.
Fortuitously, at the same time etch the quartz. ... the amount of feldspar A binocular microscope in the laboratory is remaining after HF etching is so low that it cannot be necessary, used to examine tiny amounts of the detected with X-ray diffraction. ... Minimizing feldspar OSL contamination in quartz UV-OSL using pulsed blue stimulation.
Spectra of natural thermoluminescence (TL) from quartz fractions of samples from aeolian sand-ramps in the Mojave Desert, California, are used to examine problems concerning sample pretreatments, particularly HF etching, and subsequent choice of broad-band filters for TL dating.
2, aggressive treatment with HF acid to etch quartz grains surfaces and breakdown feldspars, as well as HCl and Na-pyrophosphate rinses to remove precipitates and particulates. After drying, the clean sand grains were attached to aliquots for OSL measurements .
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